Current/peak current: 60A*4/80A*4
BEC: None Scable=25
Firmware: AM32/ESCape32 option
Work temperature: -20°C to 115°C
PCB fabric: 8 Layers 3OZ+Extra Copper
Weight: 26.8g
Firmware: AM32_NEUTRON_4IN1_F421/NEUTRON1
Signal protocol: Dshot 150/300/600/PWM
MCU:AT32F421G8U7
Input Voltage: DC 9-40V (3-8S LIPO)
Telemetry Signal: Supported
Hole Size: 30.5*30.5mm, M4
Cooling mode: extra copper air cooling
Size: 42*44*8mm
Capacitor : 14PCS 47uF/25V MLCC
Voltage/Current : Bus current sensor
An external solder copper plate enhances heat dissipation.
The solder copper plate is directly soldered to the PCB using the SMT process, with a thermal conductivity of 400-480W/m.k.
Common thermal grease bonding has a thermal conductivity of 5-10W/m.k.
The thermal conductivity difference between the two bonding methods is 40 times or more.
The 8S version uses silver-plated brass,
while the 12S version uses gold-plated brass.
Colors are used to identify voltage versions.
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